Invention Grant
- Patent Title: Solder bump for ball grid array
- Patent Title (中): 球栅阵列的焊球
-
Application No.: US13572302Application Date: 2012-08-10
-
Publication No.: US09159687B2Publication Date: 2015-10-13
- Inventor: Jung-Hua Chang , Cheng-Lin Huang , Jing-Cheng Lin
- Applicant: Jung-Hua Chang , Cheng-Lin Huang , Jing-Cheng Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater and Matsil, L.L.P.
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; H01L23/498
Abstract:
A solder bump structure for a ball grid array (BGA) includes at least one under bump metal (UBM) layer and a solder bump formed over the at least one UBM layer. The solder bump has a bump width and a bump height and the ratio of the bump height over the bump width is less than 1.
Public/Granted literature
- US08796833B2 Solder bump for ball grid array Public/Granted day:2014-08-05
Information query
IPC分类:
