Invention Grant
- Patent Title: Photodetection device and sensor package
- Patent Title (中): 光电检测装置和传感器封装
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Application No.: US14464020Application Date: 2014-08-20
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Publication No.: US09159757B2Publication Date: 2015-10-13
- Inventor: Yoshitsugu Uedaira , Takahiro Kitahara
- Applicant: Rohm Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Fish & Richardson P.C.
- Priority: JP2013-193272 20130918
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A photodetection device of the present invention includes a semiconductor substrate which is defined such that a first light-receiving portion and a second light-receiving portion are spaced from one another, and an optical filter which is formed on the semiconductor substrate, and includes a first filter which is disposed so as to cover the first light-receiving portion, to selectively allow an optic element in a first wavelength band to transmit through, and a second filter which is disposed so as to cover the second light-receiving portion, to selectively allow an optic element in a second wavelength band different from the first wavelength band, to transmit through, and the optical filter has a filter laminated structure which is defined such that edge portions of the first filter and the second filter overlap one another on a boundary region between the first light-receiving portion and the second light-receiving portion.
Public/Granted literature
- US20150076642A1 PHOTODETECTION DEVICE AND SENSOR PACKAGE Public/Granted day:2015-03-19
Information query
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