Invention Grant
- Patent Title: Circuit board
- Patent Title (中): 电路板
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Application No.: US13598269Application Date: 2012-08-29
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Publication No.: US09161432B2Publication Date: 2015-10-13
- Inventor: Toshio Watanabe , Isao Ichimura , Tatsuo Maeda , Takuma Nagata
- Applicant: Toshio Watanabe , Isao Ichimura , Tatsuo Maeda , Takuma Nagata
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JP2011-196819 20110909
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/02 ; H05K3/00 ; H05K3/30
Abstract:
A circuit board includes a board having a hole formed therein, and an imager that is bonded to a first region including at least a portion of the hole in a front surface of the board.
Public/Granted literature
- US20130062717A1 CIRCUIT BOARD Public/Granted day:2013-03-14
Information query
