Invention Grant
US09164142B2 Testing electronic components on electronic assemblies with large thermal mass
有权
在具有大热质量的电子组件上测试电子部件
- Patent Title: Testing electronic components on electronic assemblies with large thermal mass
- Patent Title (中): 在具有大热质量的电子组件上测试电子部件
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Application No.: US13671477Application Date: 2012-11-07
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Publication No.: US09164142B2Publication Date: 2015-10-20
- Inventor: Marc Coq , Richard J. Fishbune
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Van Leeuwen & Van Leeuwen
- Agent Damion C. Josephs
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R31/28 ; G01R1/04
Abstract:
An approach is provided in which a system under test is subjected to thermal cycling that include transferring the system under test between two different environments that generate two different ambient temperatures. In turn, a test system tests the electronic assembly in response to the electronic assembly being subjected to the thermal cycles.
Public/Granted literature
- US20140125365A1 Testing Electronic Components on Electronic Assemblies with Large Thermal Mass Public/Granted day:2014-05-08
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