Invention Grant
- Patent Title: Wireless interconnects in an interposer
- Patent Title (中): 插入器中的无线互连
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Application No.: US14069201Application Date: 2013-10-31
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Publication No.: US09165791B2Publication Date: 2015-10-20
- Inventor: Xiaoxia Wu , Yunqiang Yang , Chengjie Zuo , Durodami Joscelyn Lisk
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L21/48 ; H01L49/02 ; H01L23/538 ; H01L23/498
Abstract:
Some implementations provide an interposer that includes a substrate, a first passive device in the substrate, and a second passive device. The first passive device includes a first set of through substrate vias (TSVs) in the substrate. The second passive device is configured to wirelessly couple to the first passive device. In some implementations, the second passive device includes a second set of through substrate vias (TSVs) in the substrate. In some implementations, the second passive device is configured to inductively couple to the first passive device. In some implementations, the first passive device is a first inductor and the second passive device is a second inductor. In some implementations, the interposer further includes a first set of interconnects coupled to the first set of TSVs, and a second set of interconnects coupled to the second set of TSVs.
Public/Granted literature
- US20150115405A1 WIRELESS INTERCONNECTS IN AN INTERPOSER Public/Granted day:2015-04-30
Information query
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