Invention Grant
- Patent Title: Artificial microstructure and metamaterial using the same
- Patent Title (中): 人造微结构和超材料使用相同
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Application No.: US13634506Application Date: 2011-10-27
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Publication No.: US09166272B2Publication Date: 2015-10-20
- Inventor: Ruopeng Liu , Lin Luan , Chaofeng Kou , Fanglong He
- Applicant: Ruopeng Liu , Lin Luan , Chaofeng Kou , Fanglong He
- Applicant Address: CN Shenzhen CN Shenzhen
- Assignee: KUANG-CHI INNOVATIVE TECHNOLOGY LTD.,KUANG-CHI INSTITUTE OF ADVANCED TECHNOLOGY
- Current Assignee: KUANG-CHI INNOVATIVE TECHNOLOGY LTD.,KUANG-CHI INSTITUTE OF ADVANCED TECHNOLOGY
- Current Assignee Address: CN Shenzhen CN Shenzhen
- Agency: Leason Ellis LLP.
- International Application: PCT/CN2011/081413 WO 20111027
- International Announcement: WO2012/159418 WO 20121129
- Main IPC: H01Q1/00
- IPC: H01Q1/00 ; H01Q15/00
Abstract:
The present invention provides an artificial microstructure including a first metal wire, a second metal wire parallel to the first metal wire, at least one first metal wire branch and at least one second metal wire branch. The at least one first metal wire branch and the at least one second metal wire branch are distributed in an interlacement arrangement. One end of the at least one first metal wire branch is connected to the first metal wire; the other end is a free end facing towards the second metal wire. One end of the at least one second metal wire branch is connected to the second metal wire, and the other end of the at least one second metal wire is a free end facing towards the first metal wire. The present invention also discloses a metamaterial with the artificial microstructures.
Public/Granted literature
- US20130154901A1 ARTIFICIAL MICROSTRUCTURE AND METAMATERIAL USING THE SAME Public/Granted day:2013-06-20
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