Invention Grant
- Patent Title: Floor panel and method of laying a floor panel
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Application No.: US12364710Application Date: 2009-02-03
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Publication No.: US09169658B2Publication Date: 2015-10-27
- Inventor: Hendrick Hecht
- Applicant: Hendrick Hecht
- Applicant Address: CH Lucerne
- Assignee: KRONOTEC AG
- Current Assignee: KRONOTEC AG
- Current Assignee Address: CH Lucerne
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Andrew M. Calderon
- Priority: DE10253236 20021115
- Main IPC: E04F15/18
- IPC: E04F15/18 ; E04F15/02

Abstract:
A floor panel including structure for releasably connecting at least two panels. A tongue is formed extending in the longitudinal direction of the side edge and corresponding recess is formed opposite it. The recess comprises a top lip and a bottom lip, and the bottom lip forms a shoulder with a front shoulder side. The shoulder blocks the panels in the transverse direction. An undercut is adjoined by a recess, with a bearing region which corresponds to the shoulder, and a wall, which, with the front shoulder side in the installed state, is located opposite the latter. Form-fitting elements are formed on the wall and the front shoulder side that, in the installed state, engage one inside the other and bring about locking in the vertical direction. An underside of the tongue and a top side of the bottom lip runs parallel to the top side.
Public/Granted literature
- US20090133358A1 FLOOR PANEL AND METHOD OF LAYING A FLOOR PANEL Public/Granted day:2009-05-28
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