发明授权
- 专利标题： Methods and apparatus for transmission lines in packages
- 专利标题（中）： 包装中传输线的方法和装置
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申请号： US13750814申请日： 2013-01-25
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公开(公告)号： US09171798B2公开(公告)日： 2015-10-27
- 发明人: Yu-Ling Lin , Hsiao-Tsung Yen , Chin-Wei Kuo , Min-Chie Jeng
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H05K1/11 ; H05K1/09 ; H01L23/522 ; H01L23/525 ; H01L23/498 ; H01L23/66 ; H01L23/532 ; H01P5/02
摘要：
Methods and apparatus for forming a semiconductor device package with a transmission line using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, formed between a top device and a bottom device. A signal transmission line may be formed using a micro-bump line above a bottom device. A ground plane may be formed using a redistribution layer (RDL) within the bottom device, or using additional micro-bump lines. The RDL formed ground plane may comprise open slots. There may be RDLs at the bottom device and the top device above and below the micro-bump lines to form parts of the ground planes.
公开/授权文献
- US20140211438A1 Methods and Apparatus for Transmission Lines in Packages 公开/授权日：2014-07-31
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