Invention Grant
US09171853B2 Method of fabricating semiconductor device and device fabricated thereby 有权
制造半导体器件的方法及其制造的器件

Method of fabricating semiconductor device and device fabricated thereby
Abstract:
A semiconductor device includes a plurality of lines disposed on a semiconductor substrate, and remaining line patterns disposed spaced apart from the lines on extensions from the lines. The lines include first end-portions adjacent to the remaining line patterns. The remaining line patterns include second end-portions adjacent to the lines. The first end-portions and second end-portions are formed to have mirror symmetry with respect to each other.
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