Invention Grant
US09171934B2 Methods of forming semiconductor devices using a layer of material having a plurality of trenches formed therein 有权
使用其中形成有多个沟槽的材料层形成半导体器件的方法

Methods of forming semiconductor devices using a layer of material having a plurality of trenches formed therein
Abstract:
One method disclosed includes, among other things, forming a plurality of laterally spaced-apart source/drain trenches and a gate trench in a layer of material above an active region, performing at least one process operation through the spaced-apart source/drain trenches to form doped source/drain regions, forming a gate structure within the gate trench, and forming a gate cap layer above the gate structure positioned within the gate trench.
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