Invention Grant
- Patent Title: Connector for placement in board opening
- Patent Title (中): 连接器用于放置在开口中
-
Application No.: US13657262Application Date: 2012-10-22
-
Publication No.: US09178296B2Publication Date: 2015-11-03
- Inventor: Joshua Funamura , Phillip Satterfield , Zheng Gao , George Marc Simmel
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01R24/00
- IPC: H01R24/00 ; H01R12/71 ; H01R13/502 ; H01R13/74

Abstract:
Connector receptacles that may have a reduced height when combined with a printed circuit board and reduce wasted space inside an electronic device. One example may provide a connector receptacle that fits in an opening in a printed circuit board. The connector receptacle may also be angled at an oblique angle relative to the printed circuit board such that its face may be flush with a highly stylized device enclosure.
Public/Granted literature
- US20140113493A1 CONNECTOR FOR PLACEMENT IN BOARD OPENING Public/Granted day:2014-04-24
Information query