Invention Grant
- Patent Title: Stamp, method of manufacturing the same, and imprinting method using the stamp
- Patent Title (中): 印章，制造方法和使用印章的印记方法
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Application No.: US13489968Application Date: 2012-06-06
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Publication No.: US09180608B2Publication Date: 2015-11-10
- Inventor: Woong Ko , Ki-yeon Yang , Byung-kyu Lee , Du-hyun Lee , Jae-kwan Kim
- Applicant: Woong Ko , Ki-yeon Yang , Byung-kyu Lee , Du-hyun Lee , Jae-kwan Kim
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2011-0083055 20110819
- Main IPC: B29C33/38
- IPC: B29C33/38 ; B29C33/42 ; B29C43/02
Abstract:
A stamp includes at least one protrusion on a protrusion pattern, and an end portion of the at least one protrusion may have a non-planarized surface. The end portion of the protrusion may have a concave structure, that is, the end portion includes a center region and an edge region, and the edge region is higher than the center region.
Public/Granted literature
- US20130042779A1 STAMP, METHOD OF MANUFACTURING THE SAME, AND IMPRINTING METHOD USING THE STAMP Public/Granted day:2013-02-21
Information query
