发明授权
- 专利标题： Electronic device package and fabrication method thereof
- 专利标题（中）： 电子器件封装及其制造方法
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申请号： US12652715申请日： 2010-01-05
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公开(公告)号： US09181084B2公开(公告)日： 2015-11-10
- 发明人: Chien-Hung Liu
- 申请人： Chien-Hung Liu
- 代理机构： Liu & Liu
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; B81C1/00 ; H01L21/683 ; H01L23/00
摘要：
The invention provides an electronic device package and fabrication method thereof. The electronic device package includes a sensor chip. An upper surface of the sensor chip comprises a sensing film. A covering plate having an opening structure covers the upper surface of the sensor chip. A cavity is between the covering plate and the sensor chip, corresponding to a position of the sensing film, where the cavity communicates with the opening structure. A spacer is between the covering plate and the sensor chip, surrounding the cavity. A pressure releasing region is between the spacer and the sensing film.
公开/授权文献
- US20100171189A1 ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF 公开/授权日：2010-07-08
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