发明授权
- 专利标题: Polishing pad, manufacturing method therefor, and method for manufacturing a semiconductor device
- 专利标题(中): 抛光垫及其制造方法以及半导体装置的制造方法
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申请号: US13634218申请日: 2011-03-17
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公开(公告)号: US09181386B2公开(公告)日: 2015-11-10
- 发明人: Masato Doura , Nobuyoshi Ishizaka
- 申请人: Masato Doura , Nobuyoshi Ishizaka
- 申请人地址: JP Osaka-shi
- 专利权人: Toyo Tire & Rubber Co., Ltd.
- 当前专利权人: Toyo Tire & Rubber Co., Ltd.
- 当前专利权人地址: JP Osaka-shi
- 代理机构: Morrison & Foerster LLP
- 优先权: JP2010-072948 20100326
- 国际申请: PCT/JP2011/056455 WO 20110317
- 国际公布: WO2011/118505 WO 20110929
- 主分类号: C08G18/28
- IPC分类号: C08G18/28 ; C08G18/79 ; C08G18/42 ; C08G18/48 ; C08G101/00
摘要:
A polishing pad having a polishing layer comprising a thermoset polyurethane foam, wherein the thermoset polyurethane foam contains, as raw material components, an isocyanate component, and active-hydrogen-containing compounds, and the active-hydrogen-containing compounds comprise one or more polyol compounds (each) having two or more functional groups, and a monool compound having one functional group.
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