发明授权
US09181386B2 Polishing pad, manufacturing method therefor, and method for manufacturing a semiconductor device 有权
抛光垫及其制造方法以及半导体装置的制造方法

Polishing pad, manufacturing method therefor, and method for manufacturing a semiconductor device
摘要:
A polishing pad having a polishing layer comprising a thermoset polyurethane foam, wherein the thermoset polyurethane foam contains, as raw material components, an isocyanate component, and active-hydrogen-containing compounds, and the active-hydrogen-containing compounds comprise one or more polyol compounds (each) having two or more functional groups, and a monool compound having one functional group.
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