发明授权
- 专利标题: Silicon crystalline material and method for manufacturing the same
- 专利标题(中): 硅晶体材料及其制造方法
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申请号: US12524737申请日: 2008-01-23
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公开(公告)号: US09181631B2公开(公告)日: 2015-11-10
- 发明人: Shinji Togawa , Ryosuke Ueda
- 申请人: Shinji Togawa , Ryosuke Ueda
- 申请人地址: JP Nagasaki
- 专利权人: SUMCO TECHXIV CORPORATION
- 当前专利权人: SUMCO TECHXIV CORPORATION
- 当前专利权人地址: JP Nagasaki
- 代理机构: Greenblum & Bernstein, P.L.C.
- 优先权: JP2007-021044 20070131
- 国际申请: PCT/JP2008/050882 WO 20080123
- 国际公布: WO2008/093576 WO 20080807
- 主分类号: C30B15/00
- IPC分类号: C30B15/00 ; C30B29/06 ; C30B13/28 ; C30B13/32 ; C30B15/22
摘要:
Provided is a silicon crystalline material, which is manufactured by a CZ method to be used as a material bar for manufacturing a silicon single crystal by an FZ method and has a grasping section for being loaded in a crystal growing furnace employing the FZ method without requiring mechanical processing. A method for manufacturing such silicon crystalline material is also provided. The silicon crystalline material is manufactured by the silicon crystal manufacturing method employing the CZ method and is provided with the grasping section, which is manufactured in a similar way as a shoulder portion, a straight body portion and a tail portion in a silicon crystal growing step employing the CZ method, and is loaded in a single crystal manufacturing apparatus employing the FZ method to grow single crystals. A seed-crystal used in the silicon crystal manufacture employing the CZ method is used as the grasping section. The grasping section is manufactured by temporarily changing crystal growing conditions to form a protruding section or a recessed section on the outer circumference surface of the straight body section or by forming a dent on the shoulder portion of the straight body portion, at the time of manufacturing the silicon crystal by the CZ method.
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