A disclosed probe assembly includes a sensor member and an outer holder including a main bore for the sensor member, the outer holder including a first coefficient of thermal expansion. The sensor member is held within a sensor bore of an inner holder. The inner holder is held within the main bore of the outer holder by an interference fit. The inner holder includes a second coefficient of thermal expansion greater than the first coefficient of thermal expansion. Expansion of the inner holder is constrained by the outer holder to maintain the sensor member within the probe bore of the inner holder at elevated temperatures.