Invention Grant
- Patent Title: Communication module
- Patent Title (中): 通讯模块
-
Application No.: US13907183Application Date: 2013-05-31
-
Publication No.: US09182558B2Publication Date: 2015-11-10
- Inventor: Hong-Bin You , Gow-Zin Yiu , Chia-Kai Weng
- Applicant: DELTA ELECTRONICS, INC.
- Applicant Address: TW Taoyuan Hsien
- Assignee: DELTA ELECTRONICS, INC.
- Current Assignee: DELTA ELECTRONICS, INC.
- Current Assignee Address: TW Taoyuan Hsien
- Agent Kirton McConkie; Evan R. Witt
- Priority: TW101144943A 20121130
- Main IPC: G02B6/42
- IPC: G02B6/42

Abstract:
A communication module includes a housing member, an electronic module, and a slidable mechanism. The housing member includes at least one fastening and releasing region, which is disposed on an external surface thereof. The fastening and releasing region has a first slant. The electronic module is partially disposed within the housing member. The slidable mechanism includes at least one extension arm with a second slant. The extension arm is accommodated within the corresponding fastening and releasing region. The second slant is aligned with the first slant, and a slope of the second slant is larger than a slope of the first slant.
Public/Granted literature
- US20140153195A1 COMMUNICATION MODULE Public/Granted day:2014-06-05
Information query