发明授权
- 专利标题： Laminated ceramic electronic component and manufacturing method therefor
- 专利标题（中）： 层压陶瓷电子元件及其制造方法
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申请号： US13956616申请日： 2013-08-01
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公开(公告)号： US09183986B2公开(公告)日： 2015-11-10
- 发明人: Yosuke Hirata , Hideaki Tsuji , Nagato Omori , Hiroyuki Wada , Takashi Hiramatsu , Yoshito Saito
- 申请人： Yosuke Hirata , Hideaki Tsuji , Nagato Omori , Hiroyuki Wada , Takashi Hiramatsu , Yoshito Saito
- 申请人地址： JP Nagaokakyo-Shi, Kyoto-Fu
- 专利权人： MURATA MANUFACTURING CO., LTD.
- 当前专利权人： MURATA MANUFACTURING CO., LTD.
- 当前专利权人地址： JP Nagaokakyo-Shi, Kyoto-Fu
- 代理机构： Arent Fox LLP
- 优先权： JP2009-141866 20090615; JP2009-156655 20090701
- 主分类号： H01G4/12
- IPC分类号： H01G4/12 ; H01G4/005 ; B32B18/00 ; C04B35/468 ; C04B35/626 ; H01G4/012 ; H01G4/30
摘要：
A laminated body is divided into a large grain region and a small grain region. The large grain region is located outside the small grain region, and a boundary surface between the regions is located inside the outer surface of the laminated body while surrounding a section in which internal electrodes are present in the laminated body. To obtain the laminated body, firing is carried out with a profile in which the average rate of increase from room to the maximum temperature is 40° C./second or more.
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