A method for forming a chip package, by providing a substrate having a plurality of conducting pads below a lower surface, and a dielectric layer located between the conducting pads, forming a recess in an upper surface of the substrate, forming a hole extending through the bottom of the recess, forming an insulating layer on the sidewall of the recess and in the hole, exposing a portion of the conducting pads through the insulating layer, and forming a conducting layer on the insulating layer and through the hole to contact with the conducting pads.