发明授权
US09184121B2 Stacked synchronous buck converter having chip embedded in outside recess of leadframe
有权
堆叠同步降压转换器，其芯片嵌入引线框架的外部凹槽中
- 专利标题： Stacked synchronous buck converter having chip embedded in outside recess of leadframe
- 专利标题（中）： 堆叠同步降压转换器，其芯片嵌入引线框架的外部凹槽中
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申请号： US14173147申请日： 2014-02-05
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公开(公告)号： US09184121B2公开(公告)日： 2015-11-10
- 发明人: Osvaldo Jorge Lopez , Johathan A. Noquil
- 申请人： Texas Instruments Incorporated
- 申请人地址： US TX Dallas
- 专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人地址： US TX Dallas
- 代理商 Steven A. Shaw; Charles A. Brill; Frank D. Cimino
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L25/16 ; H01L23/00 ; H01L25/00 ; H01L23/31 ; H01L21/56 ; H01L25/065
摘要：
A power supply system (200) has a QFN leadframe with leads and a pad (201, switch node terminal); a pad surface having a portion recessed with a depth (270) and an outline suitable for attaching a semiconductor chip. A first FET chip (220) is vertically stacked to the opposite pad surface. A clip (240) is vertically stacked on the first FET chip and tied to a lead (202, grounded output terminal). A second FET chip (210) has its source terminal attached to the recessed portion and its drain (210a, input terminal) and gate (210b) terminals co-planar with the un-recessed portion. A driver-and-controller chip (230) is attached to the clip. Packaging compound (290) encapsulates the parts but leaves a pad surface and the drain and gate terminals of the second FET chip un-encapsulated.
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