Invention Grant
- Patent Title: FinFET integrated circuits and methods for their fabrication
- Patent Title (中): FinFET集成电路及其制造方法
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Application No.: US14615762Application Date: 2015-02-06
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Publication No.: US09184162B2Publication Date: 2015-11-10
- Inventor: Murat Kerem Akarvardar , Xiuyu Cai , Ajey Poovannummoottil Jacob
- Applicant: GLOBALFOUNDRIES, Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES, INC.
- Current Assignee: GLOBALFOUNDRIES, INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L27/088 ; H01L29/06

Abstract:
Fin field effect transistor integrated circuits and methods for producing the same are provided. A fin field effect transistor integrated circuit includes a plurality of fins extending from a semiconductor substrate. Each of the plurality of fins includes a fin sidewall, and each of the plurality of fins extends to a fin height such that a trough with a trough base is defined between adjacent fins. A second dielectric is positioned within the trough, where the second dielectric directly contacts the semiconductor substrate at the trough base. The second dielectric extends to a second dielectric height less than the fin height such that protruding fin portions extend above the second dielectric. A first dielectric is positioned between the fin sidewall and the second dielectric.
Public/Granted literature
- US20150179644A1 FINFET INTEGRATED CIRCUITS AND METHODS FOR THEIR FABRICATION Public/Granted day:2015-06-25
Information query
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