Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US14043062Application Date: 2013-10-01
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Publication No.: US09184173B2Publication Date: 2015-11-10
- Inventor: Tamae Takano , Tetsuya Kakehata , Shunpei Yamazaki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Enery Laboratory Co., Ltd.
- Current Assignee: Semiconductor Enery Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2007-173103 20070629
- Main IPC: H01L29/792
- IPC: H01L29/792 ; H01L27/115 ; H01L27/105 ; H01L27/12 ; H01L27/13 ; H01L29/423

Abstract:
The invention provides a semiconductor device and its manufacturing method in which a memory transistor and a plurality of thin film transistors that have gate insulating films with different thicknesses are fabricated over a substrate. The invention is characterized by the structural difference between the memory transistor and the plurality of thin film transistors. Specifically, the memory transistor and some of the plurality of thin film transistors are provided to have a bottom gate structure while the other thin film transistors are provided to have a top gate structure, which enables the reduction of characteristic defects of the transistor and simplification of its manufacturing process.
Public/Granted literature
- US20140035028A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-02-06
Information query
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