Invention Grant
US09185194B2 Handheld electronic device, support assembly, and support assembly fabricating method
有权
手持式电子设备，支撑组件和支撑组件制造方法
- Patent Title: Handheld electronic device, support assembly, and support assembly fabricating method
- Patent Title (中): 手持式电子设备，支撑组件和支撑组件制造方法
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Application No.: US14465426Application Date: 2014-08-21
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Publication No.: US09185194B2Publication Date: 2015-11-10
- Inventor: Ailan Zhu , Mingxing Yang
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: CN201310120646 20130409
- Main IPC: H04M1/00
- IPC: H04M1/00 ; H04M1/02 ; C22C47/00 ; B22D17/14 ; B22D25/06 ; B22D17/00 ; B22D21/02 ; H05K5/00
Abstract:
The present invention provides a support assembly mounted between a rear cover and a screen of a handheld electronic device to support and fasten a component of the handheld electronic device. The support assembly includes an appearance part and an internal structure support part, where the appearance part and the internal structure support part are fabricated through integral molding of an amorphous alloy; the internal structure support part is formed by extending the top or the middle of the appearance part inwards; and an average thickness of the internal structure support part is less than 2 mm. The present invention simplifies a process of assembling the handheld electronic device. The present invention further provides a support assembly fabricating method and a handheld electronic device.
Public/Granted literature
- US20150011271A1 HANDHELD ELECTRONIC DEVICE, SUPPORT ASSEMBLY, AND SUPPORT ASSEMBLY FABRICATING METHOD Public/Granted day:2015-01-08
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