Invention Grant
- Patent Title: Release films via solventless extrusion processes
- Patent Title (中): 通过无溶剂挤出工艺脱模膜
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Application No.: US13953474Application Date: 2013-07-29
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Publication No.: US09187678B2Publication Date: 2015-11-17
- Inventor: Larry D. Boardman , Jeffrey O. Emslander , Bryan C. Feisel , David S. Hays , David J. Kinning , Richard L. Peloquin , David J. Yarusso
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Sandra K. Nowak
- Main IPC: C09J7/02
- IPC: C09J7/02 ; C09D123/04 ; C08G77/38

Abstract:
Described herein are release layers formed via solventless extrusion. The release layers include a polyolefin and an alkyl dimethicone. The release layers exhibit tailorable release properties from pressure-sensitive adhesives. The release layers are simple to make and require no post-treatment in order to impart the observed release properties. The release layers are adaptable to multilayer extrusion, blown film formation, and cast film formation techniques.
Public/Granted literature
- US20150030796A1 RELEASE FILMS VIA SOLVENTLESS EXTRUSION PROCESSES Public/Granted day:2015-01-29
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