发明授权
- 专利标题: Release films via solventless extrusion processes
- 专利标题(中): 通过无溶剂挤出工艺脱模膜
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申请号: US13953474申请日: 2013-07-29
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公开(公告)号: US09187678B2公开(公告)日: 2015-11-17
- 发明人: Larry D. Boardman , Jeffrey O. Emslander , Bryan C. Feisel , David S. Hays , David J. Kinning , Richard L. Peloquin , David J. Yarusso
- 申请人: 3M INNOVATIVE PROPERTIES COMPANY
- 申请人地址: US MN St. Paul
- 专利权人: 3M Innovative Properties Company
- 当前专利权人: 3M Innovative Properties Company
- 当前专利权人地址: US MN St. Paul
- 代理商 Sandra K. Nowak
- 主分类号: C09J7/02
- IPC分类号: C09J7/02 ; C09D123/04 ; C08G77/38
摘要:
Described herein are release layers formed via solventless extrusion. The release layers include a polyolefin and an alkyl dimethicone. The release layers exhibit tailorable release properties from pressure-sensitive adhesives. The release layers are simple to make and require no post-treatment in order to impart the observed release properties. The release layers are adaptable to multilayer extrusion, blown film formation, and cast film formation techniques.
公开/授权文献
- US20150030796A1 RELEASE FILMS VIA SOLVENTLESS EXTRUSION PROCESSES 公开/授权日:2015-01-29
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