Invention Grant
- Patent Title: Pattern-based via redundancy insertion
- Patent Title (中): 基于模式的冗余插入
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Application No.: US14132926Application Date: 2013-12-18
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Publication No.: US09189589B2Publication Date: 2015-11-17
- Inventor: Swamy Muddu , Shangliang Jiang
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Heslin Rothenberg Farley & Mesiti P.C.
- Agent Wayne F. Reinke, Esq.
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Via redundancy insertion is described. A via layout is analyzed by identifying each via, and for each via, identifying a location therefore in the layout, whether the via is redundant and a layout configuration for the via. Each via is classified into a bin of similar layout configurations. For each bin of redundant vias, possible via replacement candidates are determined from a database of possible replacement vias, and the candidates are ranked according to rule-based, recommendation-based and/or model-based criteria. For each via in each bin having a replacement(s), an optimal replacement is identified from among the ranked candidates taken in ranked order that first satisfies another criteria, such as not violating an applicable design rule. The layout is then updated with the optimal replacement.
Public/Granted literature
- US20150169818A1 PATTERN-BASED VIA REDUNDANCY INSERTION Public/Granted day:2015-06-18
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