Invention Grant
US09190133B2 Apparatuses and methods for a memory die architecture including an interface memory
有权
包括接口存储器的存储器管芯结构的装置和方法
- Patent Title: Apparatuses and methods for a memory die architecture including an interface memory
- Patent Title (中): 包括接口存储器的存储器管芯结构的装置和方法
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Application No.: US13793347Application Date: 2013-03-11
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Publication No.: US09190133B2Publication Date: 2015-11-17
- Inventor: Dean K. Nobunaga , Ali Feiz Zarrin Ghalam , Xiaojiang Guo , Eric N. Lee
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Dorsey & Whitney LLP
- Main IPC: G06F12/00
- IPC: G06F12/00 ; G11C11/00 ; G06F12/08

Abstract:
Apparatuses and methods for reducing capacitance on a data bus are disclosed herein. In accordance with one or more described embodiments, an apparatus may comprise a plurality of memories coupled to an internal data bus and a command and address bus, each of the memories configured to receive a command on the command and address bus. One of the plurality of memories may be coupled to an external data bus. The one of the plurality of memories may be configured to provide program data to the internal data bus when the command comprises a program command and another of the plurality of memories is a target memory of the program command and may be configured to provide read data to the external data bus when the command comprises a read command and the another of the plurality of memories is a target memory of the read command.
Public/Granted literature
- US20140258619A1 APPARATUSES AND METHODS FOR A MEMORY DIE ARCHITECTURE Public/Granted day:2014-09-11
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