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US09190322B2 Method for producing a copper layer on a semiconductor body using a printing process 有权
使用印刷方法在半导体主体上制造铜层的方法

Method for producing a copper layer on a semiconductor body using a printing process
Abstract:
A method for producing a metal layer on a wafer is described. In one embodiment the method comprises providing a semiconductor wafer including a coating, printing a metal particle paste on the semiconductor wafer thereby forming a metal layer and heating the metal layer in a reductive gas for sintering the metal particle paste or for annealing a sintered metal particle paste in an oven.
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