Invention Grant
- Patent Title: Multi chip package, manufacturing method thereof, and memory system having the multi chip package
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Application No.: US14705416Application Date: 2015-05-06
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Publication No.: US09190357B2Publication Date: 2015-11-17
- Inventor: Byung-Hyun Lee , Hoon Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2011-0035951 20110419
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/525 ; H01L25/00 ; H01L25/065
Abstract:
A multi-chip package is provided. The multi-chip package includes a plurality of chips including at least one bad chip and at least one good chip that are stacked and a plurality of through electrodes each penetrating the chips. A logic circuit included in the at least one bad chip is isolated from each of the plurality of through electrodes.
Public/Granted literature
- US20150235947A1 MULTI CHIP PACKAGE, MANUFACTURING METHOD THEREOF, AND MEMORY SYSTEM HAVING THE MULTI CHIP PACKAGE Public/Granted day:2015-08-20
Information query
IPC分类:
