Invention Grant
US09190362B2 Image sensor package with trench insulator and fabrication method thereof
有权
具有沟槽绝缘体的图像传感器封装及其制造方法
- Patent Title: Image sensor package with trench insulator and fabrication method thereof
- Patent Title (中): 具有沟槽绝缘体的图像传感器封装及其制造方法
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Application No.: US14325812Application Date: 2014-07-08
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Publication No.: US09190362B2Publication Date: 2015-11-17
- Inventor: Wen-Cheng Chien , Wen-Ken Huang , Chien-Hung Liu , Joey Lai
- Applicant: XINTEC INC.
- Applicant Address: TW Taoyuan
- Assignee: XINTEC INC.
- Current Assignee: XINTEC INC.
- Current Assignee Address: TW Taoyuan
- Agency: Liu & Liu
- Priority: TW96129207A 20070808
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H01L27/146
Abstract:
The invention provides a chip package and a fabrication method thereof. In one embodiment, the chip package includes: a substrate having a semiconductor device and a conductive pad thereon; an insulator ring filling a trench formed in the substrate, wherein the insulator ring surrounds an intermediate layer below the conductive pad; and a conductive layer disposed below a backside of the substrate and electrically connected to the conductive pad.
Public/Granted literature
- US20140319670A1 IMAGE SENSOR PACKAGE WITH TRENCH INSULATOR AND FABRICATION METHOD THEREOF Public/Granted day:2014-10-30
Information query
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