发明授权
- 专利标题: Manufacturing method for thin board-shaped fired piezoelectric body
- 专利标题(中): 薄板状烧结压电体制造方法
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申请号: US13273608申请日: 2011-10-14
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公开(公告)号: US09190604B2公开(公告)日: 2015-11-17
- 发明人: Nobuo Takahashi , Takao Ohnishi
- 申请人: Nobuo Takahashi , Takao Ohnishi
- 申请人地址: JP Nagoya
- 专利权人: NGK Insulators, Ltd.
- 当前专利权人: NGK Insulators, Ltd.
- 当前专利权人地址: JP Nagoya
- 代理机构: Burr & Brown, PLLC
- 优先权: JP2009-106663 20090424
- 主分类号: H01L41/25
- IPC分类号: H01L41/25 ; H01L41/273 ; H01L41/053 ; H01L41/29 ; H01L41/33 ; H01L41/35 ; H01L41/338 ; H01L41/43 ; C04B35/622 ; H01L21/48 ; C04B35/634
摘要:
A manufacturing method for a thin board-shaped fired piezoelectric body has: a step of manufacturing, using a piezoelectric material, a green sheet having a ratio T/L of 0.000002 to 0.2, where T is the thickness and L is the maximum length within the surface after firing; and a step of obtaining the thin board-shaped fired piezoelectric body with reinforcing members for firing by performing firing after disposing the reinforcing members for firing by scattering at least on one surface of the green sheet so as to exclude the areas to be the thin board-shaped fired piezoelectric body later. The piezoelectric body which has excellent planarity and a thin board shape can be manufactured at low cost by the method.
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