Invention Grant
- Patent Title: Integrated thermistor and metallic element device and method
- Patent Title (中): 集成热敏电阻和金属元件装置及方法
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Application No.: US13741974Application Date: 2013-01-15
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Publication No.: US09190833B2Publication Date: 2015-11-17
- Inventor: James A. Colby , Stephen Whitnery , Du Yaosheng
- Applicant: Littelfuse, Inc.
- Applicant Address: US IL Chicago
- Assignee: LITTELFUSE, INC.
- Current Assignee: LITTELFUSE, INC.
- Current Assignee Address: US IL Chicago
- Agency: Kacvinsky Daisak Bluni PLLC
- Main IPC: H02H5/00
- IPC: H02H5/00 ; H02H5/04 ; H01C7/02 ; H01H85/041 ; H01H85/046 ; H01H85/048 ; H03K17/687 ; H03K17/72 ; H03K17/74

Abstract:
A circuit protection device includes a fuse element placed in parallel with a PTC thermistor layer. The element and PTC thermistor layer are provided on one or more insulating substrate, such as an FR-4 or polyimide substrate. First and second conductors connect the fuse element and PTC thermistor layer electrically in parallel, such that current (i) initially under normal flows mainly through the fuse element and PTC thermistor layer at a lower drop in voltage and (ii) after an opening of the fuse element flows under normal operation through the PTC thermistor layer at a higher drop in voltage.
Public/Granted literature
- US20130128406A1 Integrated Thermistor and Metallic Element Device and Method Public/Granted day:2013-05-23
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