Invention Grant
- Patent Title: Shielding structure for use in an electronic device
- Patent Title (中): 用于电子设备的屏蔽结构
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Application No.: US14138220Application Date: 2013-12-23
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Publication No.: US09191474B2Publication Date: 2015-11-17
- Inventor: Young-Kwang Song , Sung-Won Park , Yong-Lak Cho
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Cha & Reiter, LLC
- Priority: KR10-2012-0151089 20121221
- Main IPC: H04M1/02
- IPC: H04M1/02 ; H04B1/3888 ; H05K9/00 ; H04M1/19
Abstract:
An electronic device is provided including a mainboard having a ground; a conductive bracket coupled to the mainboard; and an elastic member coupled to the mainboard, and electrically connected with the ground of the mainboard; wherein the elastic member is in elastic contact with the conductive bracket; and wherein the elastic member is electrically connected to the conductive bracket.
Public/Granted literature
- US20140177186A1 SHIELDING STRUCTURE FOR USE IN AN ELECTRONIC DEVICE Public/Granted day:2014-06-26
Information query
