发明授权
- 专利标题： Camera module, manufacturing apparatus, and manufacturing method
- 专利标题（中）： 相机模块，制造装置和制造方法
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申请号： US13565246申请日： 2012-08-02
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公开(公告)号： US09191559B2公开(公告)日： 2015-11-17
- 发明人: Masahiko Shimizu , Toshiaki Iwafuchi
- 申请人： Masahiko Shimizu , Toshiaki Iwafuchi
- 申请人地址： JP Tokyo
- 专利权人： SONY CORPORATION
- 当前专利权人： SONY CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Hazuki International, LLC
- 优先权： JP2011-173694 20110809
- 主分类号： H04N5/225
- IPC分类号： H04N5/225
摘要：
A camera module includes an imaging sensor, a conductive member, a plate-like member, and a sealing member. The imaging sensor includes a light-receiving surface configured to receive light gathered by a lens unit, the lens unit including a lens and a drive section driving the lens. The conductive member is connected to the drive section for supply of power to the drive section. The plate-like member is provided with the imaging sensor and the conductive member. The sealing member is formed by sealing the imaging sensor and the conductive member, the conductive member being exposed at a connection part for connection to the drive section, the imaging sensor being exposed at the light-receiving surface.
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