发明授权
- 专利标题： Perforated materials for printing
- 专利标题（中）： 打孔材料
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申请号： US14388541申请日： 2012-04-27
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公开(公告)号： US09193202B2公开(公告)日： 2015-11-24
- 发明人: Luis Garcia Garcia , Sergio Puigardeu Aramendia , M. Isabel Borrell Bayona , Angel Martinez Barambio
- 申请人： Luis Garcia Garcia , Sergio Puigardeu Aramendia , M. Isabel Borrell Bayona , Angel Martinez Barambio
- 代理机构： Hewlett-Packard Patent Department
- 国际申请： PCT/EP2012/057821 WO 20120427
- 国际公布： WO2013/159829 WO 20131031
- 主分类号： B41J2/015
- IPC分类号： B41J2/015 ; B32B3/10 ; B41M5/00 ; B41M3/00 ; G09F21/04 ; B41M5/50 ; B44F1/06
摘要：
Print media products comprise a top layer of a printing material comprising a plurality of holes distributed on the surface area thereof, and a bottom layer of a printing material comprising a plurality of holes distributed on the surface area thereof, the top layer being overlayed on and removably attached to the bottom layer such that an ink-receiving side of the top layer is exposed and an ink-receiving side of the bottom layer is in contact with the top layer, and such that the holes of the top layer are at least in part overlapped with print material of the bottom layer.
公开/授权文献
- US20150130871A1 PERFORATED MATERIALS FOR PRINTING 公开/授权日：2015-05-14