Invention Grant
- Patent Title: Heat-sink/connector system for light emitting diode
- Patent Title (中): 用于发光二极管的散热器/连接器系统
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Application No.: US13994019Application Date: 2011-12-14
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Publication No.: US09194573B2Publication Date: 2015-11-24
- Inventor: Juan J. Barrena , Edward J. Claprood , Eric K. Larson
- Applicant: Juan J. Barrena , Edward J. Claprood , Eric K. Larson
- Applicant Address: US IL Glenview
- Assignee: Illinois Tool Works Inc.
- Current Assignee: Illinois Tool Works Inc.
- Current Assignee Address: US IL Glenview
- International Application: PCT/US2011/064952 WO 20111214
- International Announcement: WO2012/082925 WO 20120621
- Main IPC: F21V29/00
- IPC: F21V29/00 ; F21K99/00 ; F21V17/00 ; F21V17/16 ; F21V29/70 ; F21Y101/02
Abstract:
An assembly for high-powered LEDs provides a direct attachment of the LED to a ceramic thermal conductor/electrical insulator sealed in a housing with a compression element between a portion of the housing and ceramic heat sink to provide a predetermined range of biasing force locating the ceramic heat sink against the portion of the housing with dimensional changes in the ceramic heat sink caused by thermal expansion of the ceramic heat sink.
Public/Granted literature
- US20130265782A1 HEAT-SINK/CONNECTOR SYSTEM FOR LIGHT EMITTING DIODE Public/Granted day:2013-10-10
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