Invention Grant
- Patent Title: Stacked device identification assignment
- Patent Title (中): 堆叠设备识别分配
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Application No.: US14511794Application Date: 2014-10-10
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Publication No.: US09196313B2Publication Date: 2015-11-24
- Inventor: Brent Keeth
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: G11C5/02
- IPC: G11C5/02 ; G11C5/06 ; H01L23/12 ; H01L23/48 ; G11C7/20 ; G11C7/10

Abstract:
Some embodiments include apparatus and methods having dice arranged in a stack. The dice include at least a first die and a second die, and a connection coupled to the dice. The connection may be configured to transfer control information to the first die during an assignment of a first identification to the first die and to transfer the control information from the first die to the second die during an assignment of a second identification to the second die.
Public/Granted literature
- US20150029774A1 STACKED DEVICE IDENTIFICATION ASSIGNMENT Public/Granted day:2015-01-29
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