发明授权
- 专利标题： Semiconductor device
- 专利标题（中）： 半导体器件
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申请号： US14471278申请日： 2014-08-28
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公开(公告)号： US09196570B2公开(公告)日： 2015-11-24
- 发明人: Kiyotada Funane
- 申请人： Renesas Electronics Corporation
- 申请人地址： JP Kanagawa
- 专利权人： Renesas Electronics Corporation
- 当前专利权人： Renesas Electronics Corporation
- 当前专利权人地址： JP Kanagawa
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2012-037968 20120223
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L27/11 ; G11C5/06 ; G11C5/14 ; G11C11/417 ; H01L27/02 ; H01L23/528
摘要：
To reinforce power supply wirings without sacrificing the interconnectivity of semiconductor devices. When three wirings are formed in parallel in the same wiring layer and the center wiring among them is shorter than the outer wirings, a projecting portion integrated into the outer wiring is formed utilizing a free space remaining on the extension of the center wiring. For example, when the outer wirings are used as power supply wirings, the power supply wirings can be reinforced by adding the projecting portion. At this time, because the projecting portion is arranged in the free space, the interconnectivity is not sacrificed.
公开/授权文献
- US20150008590A1 SEMICONDUCTOR DEVICE 公开/授权日：2015-01-08
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