发明授权
- 专利标题: Enhancement mode III-N HEMTs
- 专利标题(中): 增强模式III-N HEMTs
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申请号: US14464639申请日: 2014-08-20
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公开(公告)号: US09196716B2公开(公告)日: 2015-11-24
- 发明人: Umesh Mishra , Robert Coffie , Likun Shen , Ilan Ben-Yaacov , Primit Parikh
- 申请人: Transphorm Inc.
- 申请人地址: US CA Goleta
- 专利权人: Transphorm Inc.
- 当前专利权人: Transphorm Inc.
- 当前专利权人地址: US CA Goleta
- 代理机构: Fish & Richardson P.C.
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L29/778 ; H01L29/20 ; H01L29/36 ; H01L29/423 ; H01L29/08 ; H01L29/10
摘要:
A III-N semiconductor device that includes a substrate and a nitride channel layer including a region partly beneath a gate region, and two channel access regions on opposite sides of the part beneath the gate. The channel access regions may be in a different layer from the region beneath the gate. The device includes an AlXN layer adjacent the channel layer wherein X is gallium, indium or their combination, and a preferably n-doped GaN layer adjacent the AlXN layer in the areas adjacent to the channel access regions. The concentration of Al in the AlXN layer, the AlXN layer thickness and the n-doping concentration in the n-doped GaN layer are selected to induce a 2DEG charge in channel access regions without inducing any substantial 2DEG charge beneath the gate, so that the channel is not conductive in the absence of a switching voltage applied to the gate.
公开/授权文献
- US20140361309A1 Enhancement Mode III-N HEMTs 公开/授权日:2014-12-11
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