Invention Grant
- Patent Title: Resonator device including electrodes with buried temperature compensating layers
- Patent Title (中): 谐振器器件包括具有埋入温度补偿层的电极
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Application No.: US13601384Application Date: 2012-08-31
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Publication No.: US09197185B2Publication Date: 2015-11-24
- Inventor: Qiang Zou , Zhiqiang Bi , Kristina Lamers , Richard C. Ruby
- Applicant: Qiang Zou , Zhiqiang Bi , Kristina Lamers , Richard C. Ruby
- Applicant Address: SG Singapore
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H03H9/17
- IPC: H03H9/17 ; H03H3/04 ; H03H9/02 ; H03H9/13

Abstract:
An acoustic resonator includes a substrate and a first composite electrode disposed over the substrate. The first composite electrode includes first and second electrically conductive layers and a first temperature compensating layer disposed between the first and second electrically conductive layers. The second electrically conductive layer forms a first electrical contact with the first electrically conductive layer on at least one side of the first temperature compensating layer, and the first electrical contact electrically shorts a first capacitive component of the first temperature compensating layer.
Public/Granted literature
- US20130049545A1 RESONATOR DEVICE INCLUDING ELECTRODES WITH BURIED TEMPERATURE COMPENSATING LAYERS Public/Granted day:2013-02-28
Information query
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