Invention Grant
- Patent Title: Electronic component including a surface acoustic wave element and a pillar member
- Patent Title (中): 包括表面声波元件和柱构件的电子部件
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Application No.: US14014839Application Date: 2013-08-30
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Publication No.: US09197192B2Publication Date: 2015-11-24
- Inventor: Syuji Yamato , Mitsuyoshi Hira
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2011-051122 20110309
- Main IPC: H03H9/64
- IPC: H03H9/64 ; H03H9/05 ; H03H9/10

Abstract:
An electronic component includes a support layer that surrounds an element region on a principal surface of a piezoelectric substrate, when viewed in plan from a z-axis direction. A surface acoustic wave element is provided in the element region. A cover layer is provided on the support layer, and is opposed to the principal surface. A pillar member connects the principal surface and the cover layer in a space surrounded by the principal surface, the support layer, and the cover layer, and does not contact with the support layer.
Public/Granted literature
- US20130335171A1 ELECTRONIC COMPONENT Public/Granted day:2013-12-19
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