Invention Grant
US09198278B2 Apparatus and method of miniaturizing the size of a printed circuit board
有权
使印刷电路板的尺寸小型化的装置和方法
- Patent Title: Apparatus and method of miniaturizing the size of a printed circuit board
- Patent Title (中): 使印刷电路板的尺寸小型化的装置和方法
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Application No.: US14188998Application Date: 2014-02-25
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Publication No.: US09198278B2Publication Date: 2015-11-24
- Inventor: Khai Loke Lim , Kow Chee Chong , Macwien Krishnamurthi , Swee Theam Thor
- Applicant: MOTOROLA SOLUTIONS, INC
- Applicant Address: US IL Schaumburg
- Assignee: Motorola Solutions, Inc.
- Current Assignee: Motorola Solutions, Inc.
- Current Assignee Address: US IL Schaumburg
- Agent Barbara R. Doutre
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H05K1/02 ; H05K1/03 ; H05K1/09 ; H05K1/11 ; H05K3/42 ; H05K3/00 ; H01L21/44
Abstract:
A printed circuit board includes at least one plated-through hole via drilled into at least one of a first layer on a first side of the printed circuit board and a second layer on a second side of the printed circuit board. The printed circuit board also includes a core section laminated between the first layer and the second layer, wherein a length of the core section is shorter than a length of the first layer and a length of the second layer. The printed circuit board further includes an open slot configured to house a connection tab of an electronic product connected to the printed circuit board, wherein the open slot is formed adjacent to the core section and between sections of the first layer and the second layer that are longer than the core section.
Public/Granted literature
- US20150245467A1 APPARATUS AND METHOD OF MINIATURIZING THE SIZE OF A PRINTED CIRCUIT BOARD Public/Granted day:2015-08-27
Information query
IPC分类:
