发明授权
- 专利标题: Closed-loop temperature equalization device having a heat releasing system structured by multiple flowpaths
- 专利标题(中): 具有由多个流路构成的散热系统的闭环温度均衡装置
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申请号: US13209579申请日: 2011-08-15
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公开(公告)号: US09200850B2公开(公告)日: 2015-12-01
- 发明人: Tai-Her Yang
- 申请人: Tai-Her Yang
- 代理机构: Bacon & Thomas, PLLC
- 主分类号: F25B29/00
- IPC分类号: F25B29/00 ; F28D15/00 ; F28F1/42 ; F28D20/00 ; F28F1/02 ; F28F1/10 ; F28F1/16 ; F28F1/22 ; F28D21/00 ; F24J3/08
摘要:
A closed-loop heat equalization system includes a heat gaining device installed within a natural thermal energy storage body, and a heat releasing device having multiple flowpaths, the heat gaining and releasing devices being connected by pipeline structures to form a closed-loop flowpath for a heat exchange fluid. An outwardly expanded arc-shaped structure may be included at one or more turning locations in the pipeline structures. The pipeline structures may include an operation port and sealing plug at a top corner of the closed-loop flowpath, and an auxiliary heating/cooling device or fluid pump controlled by a sensing device and an electric energy control unit.
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