发明授权
- 专利标题： Conductive paste composition for external electrode and multilayer ceramic electronic component fabricated using the same
- 专利标题（中）： 用于外部电极的导电糊组合物和使用其制造的多层陶瓷电子部件
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申请号： US13912852申请日： 2013-06-07
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公开(公告)号： US09202624B2公开(公告)日： 2015-12-01
- 发明人: Jae Choon Cho , Hee Sun Chun , Choon Keun Lee
- 申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： NSIP Law
- 优先权： KR10-2012-0062253 20120611
- 主分类号： H01G4/228
- IPC分类号： H01G4/228 ; H01G4/008 ; H01G4/30 ; H01G4/232 ; H01G4/12
摘要：
There are provided a conductive paste composition for an external electrode and a multilayer ceramic electronic component fabricated using the same, the conductive paste composition for an external electrode including: a conductive metal powder; and a resin mixture including at least one resin selected from a group consisting of an epoxy-based resin and a phenoxy-based resin, and a polyvinyl formal resin.
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