发明授权
- 专利标题： Substrate mounting mechanism, and substrate processing apparatus
- 专利标题（中）： 基板安装机构和基板处理装置
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申请号： US13452488申请日： 2012-04-20
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公开(公告)号： US09202728B2公开(公告)日： 2015-12-01
- 发明人: Masamichi Hara , Atsushi Gomi , Shinji Maekawa , Satoshi Taga , Kaoru Yamamoto
- 申请人： Masamichi Hara , Atsushi Gomi , Shinji Maekawa , Satoshi Taga , Kaoru Yamamoto
- 申请人地址： JP Tokyo
- 专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2007-234852 20070911; JP2008-216970 20080826
- 主分类号： C23C16/458
- IPC分类号： C23C16/458 ; H01L21/67 ; C23C16/52
摘要：
A substrate mounting mechanism on which a target substrate is placed is provided. The substrate mounting mechanism includes a heater plate, which has a substrate mounting surface on which the target substrate is placed and has a heater embedded therein to heat the substrate to a deposition temperature at which a film is deposited. The substrate mounting mechanism also includes a temperature control jacket, which is formed to cover at least a surface of the heater plate other than the substrate mounting surface and adjusts the temperature to a non-deposition temperature below the deposition temperature.
公开/授权文献
- US20120199573A1 SUBSTRATE MOUNTING MECHANISM, AND SUBSTRATE PROCESSING 公开/授权日：2012-08-09
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