发明授权
- 专利标题： Circuit connecting material and semiconductor device manufacturing method using same
- 专利标题（中）： 电路连接材料和使用其的半导体器件制造方法
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申请号： US14387783申请日： 2013-03-06
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公开(公告)号： US09202755B2公开(公告)日： 2015-12-01
- 发明人: Hironobu Moriyama
- 申请人： DEXERIALS CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： DEXERIALS CORPORATION
- 当前专利权人： DEXERIALS CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Oliff PLC
- 优先权： JP2012-079542 20120330
- 国际申请： PCT/JP2013/056123 WO 20130306
- 国际公布： WO2013/146141 WO 20131003
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/78 ; H01L23/00 ; H01L21/683 ; H01L25/065 ; H01L25/00 ; C09J7/00 ; H01L21/56
摘要：
Provided are a circuit connecting material able to provide good bonding with an opposing electrode, and a semiconductor device manufacturing method using the same. The present invention uses a circuit connecting material, in which a first adhesive layer to be adhered to the semiconductor chip side, and a second adhesive layer having a lowest melting viscosity attainment temperature higher than that of the first adhesive layer are laminated. When the semiconductor chip on which the circuit connecting material is stuck is mounted on a circuit board, a thickness of the first adhesive layer is within a range satisfying formula (1), thereby providing good bonding with the opposing electrode.
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