发明授权
- 专利标题： Semiconductor module
- 专利标题（中）： 半导体模块
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申请号： US13789064申请日： 2013-03-07
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公开(公告)号： US09202768B2公开(公告)日： 2015-12-01
- 发明人: Hideo Aoki , Katsuhiko Oyama , Taku Nishiyama , Chiaki Takubo , Katsuya Sakai
- 申请人： Kabushiki Kaisha Toshiba
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Patterson & Sheridan, LLP
- 主分类号： H01L21/336
- IPC分类号： H01L21/336 ; H01L23/48 ; H01L23/367 ; H01L23/42 ; H01L23/427 ; H01L23/467
摘要：
According to one embodiment, a semiconductor module has a substrate, two nonvolatile memories disposed on a first surface of the substrate, a controller to control the nonvolatile memories, disposed on the first surface of the substrate and between the two nonvolatile memories, and a plurality of terminals that are electrically connected to the two nonvolatile memories and to the controller, disposed on a second surface of the substrate.
公开/授权文献
- US20140252588A1 SEMICONDUCTOR MODULE 公开/授权日：2014-09-11
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