发明授权
- 专利标题： Dual-side illumination image sensor chips and methods for forming the same
- 专利标题（中）： 双面照明图像传感器芯片及其形成方法
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申请号： US13683819申请日： 2012-11-21
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公开(公告)号： US09202963B2公开(公告)日： 2015-12-01
- 发明人: Chih-Min Liu , Honyih Tu , Calvin Yi-Ping Chao , Fu-Lung Hsueh
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L31/18
- IPC分类号： H01L31/18 ; H01L27/146
摘要：
A Dual-Side Illumination (DSI) image sensor chip includes a first image sensor chip configured to sense light from a first direction, and a second image sensor chip aligned to, and bonded to, the first image sensor chip. The second image sensor chip is configured to sense light from a second direction opposite the first direction.
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