发明授权
- 专利标题: Power amplifier
- 专利标题(中): 功率放大器
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申请号: US13433410申请日: 2012-03-29
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公开(公告)号: US09203357B2公开(公告)日: 2015-12-01
- 发明人: Shinichi Miwa , Yoshihiro Tsukahara , Ko Kanaya , Naoki Kosaka
- 申请人: Shinichi Miwa , Yoshihiro Tsukahara , Ko Kanaya , Naoki Kosaka
- 申请人地址: JP Tokyo
- 专利权人: MITSUBISHI ELECTRIC CORPORATION
- 当前专利权人: MITSUBISHI ELECTRIC CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Leydig, Voit & Mayer, Ltd.
- 优先权: JP2011-170860 20110804
- 主分类号: H01L27/085
- IPC分类号: H01L27/085 ; H01L23/66 ; H03F1/56 ; H01L27/02 ; H01L27/06 ; H03F3/195 ; H03F3/21 ; H03F3/24 ; H01L23/64 ; H01L21/8252
摘要:
A power amplifier includes a semiconductor substrate including transistor cells, a drain electrode for the transistor cells located on the semiconductor substrate, a drain pad located on the semiconductor substrate and connected to the drain electrode, an ion-implanted resistance located in the semiconductor substrate and extending along and in contact with the drain pad, a floating electrode located on the semiconductor substrate and in contact with the ion-implanted resistance, and an output matching circuit located outside the semiconductor substrate. The power amplifier further includes a wire connecting the drain pad to the output matching circuit.
公开/授权文献
- US20130032817A1 POWER AMPLIFIER 公开/授权日:2013-02-07
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