Invention Grant
- Patent Title: Encapsulation
- Patent Title (中): 封装
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Application No.: US12904755Application Date: 2010-10-14
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Publication No.: US09205395B2Publication Date: 2015-12-08
- Inventor: Nianxi Yan
- Applicant: Nianxi Yan
- Applicant Address: US WI Appleton
- Assignee: Encapsys, LLC
- Current Assignee: Encapsys, LLC
- Current Assignee Address: US WI Appleton
- Agency: Fitch, Even, Tabin & Flannery LLP
- Main IPC: A61K47/42
- IPC: A61K47/42 ; A61K47/06 ; A23P1/04 ; B01J13/14 ; A23L1/00 ; A23L1/22 ; A61K9/50 ; B01J13/10 ; A23L1/29

Abstract:
Disclosed are encapsulating methods and encapsulated products. A payload material may be encapsulated within a wall material. The carrier material and payload material form a combination that is at least substantially solid at room temperature but that is sufficiently fluid at milling temperature to permit milling and subsequent encapsulation. The payload material may be, for instance, a bitter tasting material. In some embodiments, the microcapsules will serve a taste masking function. In other embodiments, the microcapsules may be used where a slow release of the payload material is desired.
Public/Granted literature
- US20110092605A1 Encapsulation Public/Granted day:2011-04-21
Information query
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