发明授权
- 专利标题： High thermal conductivity shell molds
- 专利标题（中）： 高导热性壳模
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申请号： US14091386申请日： 2013-11-27
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公开(公告)号： US09205484B2公开(公告)日： 2015-12-08
- 发明人: Qi Zhao , Stephen Francis Rutkowski , Francis Johnson , Wanming Zhang , Min Zou
- 申请人： General Electric Company
- 申请人地址： US NY Niskayuna
- 专利权人： General Electric Company
- 当前专利权人： General Electric Company
- 当前专利权人地址： US NY Niskayuna
- 代理商 Paul J. DiConza
- 主分类号： B22C1/02
- IPC分类号： B22C1/02 ; B22C3/00 ; B22C9/02
摘要：
A shell mold is described. The shell mold includes a facecoat, a sealcoat, and a support disposed in between the facecoat and the sealcoat. The support includes a stucco in a concentration greater than about 40 volume percent of the support. The stucco includes a material that has a thermal conductivity greater than about 285 W/m-K.
公开/授权文献
- US20150144287A1 HIGH THERMAL CONDUCTIVITY SHELL MOLDS 公开/授权日：2015-05-28
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